TECHNOLOGY DEVELOPMENT

Keeping up with technological innovations,DT Microcircuits R&D department offers customers the last version of the best material and the latest available technology to reach a thinner, smaller and cheaper component.

Materials & process developments

• R&D teams in charge of Technology work in partnership with the main LTCC raw material suppliers to get the newest materials and to take advantage of their continuous improvements.
  
• Their target is to make them mature and compatible with mass-production.
• Fine lines, constrained sintering, 20 μm tape technologies, for example, were recently in mass-production.
• R&D department next targets concerns K20, K80 and other material types for a greater efficiency of passive components integration. Please go for "LTCC design guides" section to download our design guides to learn more about this.
  

Specific studies

• To support specific customer projects, DT Microcircuits offers to conduct technological studies
• Materials like tapes and inks
• LTCC processes adapted to small or large production volumes
• Assembly processes to be applied to LTCC substrates
• When needed, DT Microcircuits will involve the powerful laboratories of its mother companies into the studies.

Customer design check

• Our Technology teams, based in Taiwan and in France, are involved in most of customer projects to propose inovative solutions which improve product performances. Prior to prototype manufacturing, they analyze customers designs.
  

Analysis and simulations

• DT Microcircuits performs various kinds of analysis, from prototypes to pre-production and mass production stages. These include :
  • Cross-section
  • Thermal analysis: DSC, TGA, TMA
  • RF measurement
  • Climatic tests
  •Mechanical tests: pull-tests, shear-tests, etc.
• Close to important universities and mother companies laboratories, DT Microcircuits has an easy access to every analysis equipment which can be needed to predict LTCC substrate and assembly performances..
• Thermal and Thermo-mechanical simulations can also be performed in partnership with mother companies.