In parternship with mother companies and most competitive sub-contractors all over the world, DT Microcircuits can take in charge of components assembly on LTCC substrates.

Assembly method studies

DT Microcircuits proposes to its customers to perform studies to determine the best assembly technique for the LTCC modules they are designing, according to their application, quality and cost targets.

• Component assembly techniques: reflow, flip-chip, wire-bonding...
• Substrate assembly techniques: LGA, BGA, adhesive and wire-bonding, leads...
• Substrate protection techniques: Over-molding, metallic cover, glob top...

In partnership with the design centers of mother companies, thermal and thermo-mechanical simulations can be performed to predict the behavior of the selected technologies.

Prototype assembly

LTCC module prototypes can be assembled, under DT Microcircuits responsibility, within 1 or 2 weeks, in mother companies facilities specialized in prototyping.

When needed assembly techniques are not available inside the group, DT Microcircuits undertakes to sub-contract the assembly to well known companies, experienced in LTCC substrate assembly.

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Technical assistance

DT Microcircuits puts its knowledge of assembly of LTCC substrates at the customer's disposal to help them to solve difficulties during the assembly of LTCC substrates.

In partnership with well equipped laboratories of mother companies DT Microcircuits proceeds to needed failure analysis, assembly process experiments & reliability tests.