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1. INTRODUCTION....................................................................................4
2. DESIGN CONSIDERATION..................................................................5
....LTCC foundry services.......................................................................5
....Project flow Chart................................................................................6
....Sclaes, units & files format...............................................................7
....General recommendations for Cost
reductions...........................7
3. SUBSTRATE DESIGN AND RULES...................................................8
....Introduction..........................................................................................8
....Summary
of basic design rules......................................................9
....Panel dimensions
& registration marks......................................11
....Substrate............................................................................................13
....Conductors.........................................................................................14
....Vias......................................................................................................16
....Cavities
& windows..........................................................................18
....Embedded capacitors.....................................................................19
....Embedded inductors.......................................................................21
....Printed resistors...............................................................................23
4. METALLIZATION SELECTION........................................................25
....Metallization
& assembly techniques..........................................25
....Double metallization.......................................................................25
5. I / O'S.................................................................................................26
....Introduction.......................................................................................26
....BGA....................................................................................................26
....LGA.....................................................................................................27
....PGA....................................................................................................28
....Lead frames....................................................................................29
....Castellations...................................................................................30
6. COMPONENT ASSEMBLY............................................................31
....General considerations................................................................31
....Flip chip assembly ........................................................................31
....Wire bonding..................................................................................32
....Adhesive bonding .........................................................................33
7. CONTACT US.................................................................................34
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