MAIN APPLICATION FIELDS

LTCC is advantageous in several applications (for example telecommunications, electronic instruments) which require high density integration, high reliability and low cost.


LTCC technology provides low-cost, high passive elements (R, L, C) integration and good electrical properties with the possibility of using silver, gold, palladium, platinum as conductors. This is not achievable with HTCC technology, where the firing temperature exceeds 1000¢XC, which is only compatible with tungsten or molybdenum conductors.

The advantages of the technology make it suitable for a number of applications, i.e.:

• RF Modules
..>Mobile phone
..>Bluetooth
..>Home RF
..>IEEE 802.11
..>Hiperlan
• Microwave modules
• Opto-electronic modules
• Automotive
• Medical
• Military
• Sensor packaging