TECHNOLOGY ADVANTAGE
The DT Microcircuits Low Temperature Cofired Ceramic
technology (LTCC) offers Ceramic Multilayer Printed Circuit Boards, which
are suitable for a wide range of applications, like telecommunications,
automotive, data processing, avionics, professional and military.
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LTCC technology provides a number of advantages
as follows:
Low cost technology
- Collective process adapted to automated manufacturing equipment
- Only one firing step for all internal layers
- Silver based conductors
- Firing temperature below 1000¢XC
High reliability
- Ceramic based materials
- Temperature range from -55¢XC to + 150¢XC
- Hermetic dielectric
- Low thermal cofficient expansion
- Compatibility with bare dies
High flexibility
- Compatibility with a wide range of assembly techniques
>Bare dies: wire bonding, Flip chip,
>Packaged devices: SMT - Packaging capability (PGA, LGA, BGA, castellations¡K)
- Complex shape of substrate
- Cavities
High electrical performance
- Various tape thickness (20 to 210 £gm): low parasitic line capacitance
- Low resistivity conductor (Ag or Au ¡V 3 m£[ /square)
High integration density
- Conductor linewidth and spacing down to 75 £gm
- Buried via structures (staggered and stacked)
- Via diameter down to 100 £gm
- Via pitch down to 200 £gm
- High number of conductive layers: up to 24
- Double sided substrate capability
- Printed resistors (top or bottom)
- Integrated packaging capability
- Buried passive components